{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T07:52:41Z","timestamp":1729669961940,"version":"3.28.0"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306567","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Thermotropic liquid crystalline polyimides toward high heat conducting materials for 3D chip stack"],"prefix":"10.1109","author":[{"given":"Tomohide","family":"Murase","sequence":"first","affiliation":[]},{"given":"Hiroyuki","family":"Aikyou","sequence":"additional","affiliation":[]},{"given":"Fumikazu","family":"Mizutani","sequence":"additional","affiliation":[]},{"given":"Yu","family":"Shoji","sequence":"additional","affiliation":[]},{"given":"Tomoya","family":"Higashihara","sequence":"additional","affiliation":[]},{"given":"Mitsuru","family":"Ueda","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"3","DOI":"10.1147\/JRD.2008.5388568"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1002\/9783527623051.ch13"},{"doi-asserted-by":"publisher","key":"10","DOI":"10.1063\/1.3116509"},{"doi-asserted-by":"publisher","key":"1","DOI":"10.1007\/978-0-387-78219-5_1"},{"doi-asserted-by":"publisher","key":"7","DOI":"10.1246\/cl.2009.716"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1002\/app.12489"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1016\/0032-3861(77)90002-7"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1016\/0032-3861(77)90179-3"},{"doi-asserted-by":"publisher","key":"9","DOI":"10.1002\/(SICI)1097-4628(19991205)74:10<2404::AID-APP8>3.0.CO;2-Z"},{"doi-asserted-by":"publisher","key":"8","DOI":"10.1021\/ma071665p"},{"key":"11","doi-asserted-by":"crossref","first-page":"31101","DOI":"10.1063\/1.2168512","article-title":"adhesive wafer bonding","volume":"99","author":"niklaus","year":"2006","journal-title":"J Appl Phys"},{"doi-asserted-by":"publisher","key":"12","DOI":"10.5104\/jiepeng.2.160"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306567.pdf?arnumber=5306567","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T01:28:07Z","timestamp":1497835687000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306567\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306567","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}