{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T04:05:50Z","timestamp":1725422750596},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306568","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration"],"prefix":"10.1109","author":[{"given":"J.-C.","family":"Bea","sequence":"first","affiliation":[]},{"given":"M.","family":"Murugesan","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Ohara","sequence":"additional","affiliation":[]},{"given":"A.","family":"Noriki","sequence":"additional","affiliation":[]},{"given":"H.","family":"Kino","sequence":"additional","affiliation":[]},{"given":"K.-W.","family":"Lee","sequence":"additional","affiliation":[]},{"given":"T.","family":"Fukushima","sequence":"additional","affiliation":[]},{"given":"T.","family":"Tanaka","sequence":"additional","affiliation":[]},{"given":"M.","family":"Koyanagi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2000.904284"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609347"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2007.4419119"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007463"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.884079"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/40.710867"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1999.824289"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306568.pdf?arnumber=5306568","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T04:13:35Z","timestamp":1489896815000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306568\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306568","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}