{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T05:52:40Z","timestamp":1747806760249},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306569","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-8","source":"Crossref","is-referenced-by-count":65,"title":["Through Silicon Via(TSV) defect\/pinhole self test circuit for 3D-IC"],"prefix":"10.1109","author":[{"given":"Menglin","family":"Tsai","sequence":"first","affiliation":[]},{"given":"Amy","family":"Klooz","sequence":"additional","affiliation":[]},{"given":"Alexander","family":"Leonard","sequence":"additional","affiliation":[]},{"given":"Jennie","family":"Appel","sequence":"additional","affiliation":[]},{"given":"Paul","family":"Franzon","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373897"},{"year":"0","key":"2"},{"year":"0","key":"1"},{"key":"4","doi-asserted-by":"crossref","DOI":"10.1088\/0960-1317\/16\/6\/S06","article-title":"development of cost-effective highdensity through-wafer interconnects for 3d microsystems","author":"lietaer","year":"2006","journal-title":"Journal of Micromechanics and Microengineering"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306569.pdf?arnumber=5306569","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T01:28:06Z","timestamp":1497835686000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306569\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306569","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}