{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T04:09:40Z","timestamp":1725422980643},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306571","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-1","source":"Crossref","is-referenced-by-count":1,"title":["A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing"],"prefix":"10.1109","author":[{"given":"G.","family":"Williams","sequence":"first","affiliation":[]},{"given":"P.","family":"O'Hara","sequence":"additional","affiliation":[]},{"given":"J.","family":"Moore","sequence":"additional","affiliation":[]},{"given":"B.","family":"Gordon","sequence":"additional","affiliation":[]},{"given":"J.","family":"Rose","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","first-page":"269","article-title":"a chemical and thermal resistant wafer bonding adhesive for simplifying wafer backside processing","author":"smith","year":"2006","journal-title":"GaAs MANTECH Technical Digest"},{"key":"2","first-page":"175","article-title":"high temperature resistant adhesive for wafer thinning and backside processing, 2004 gaas mantech","author":"moore","year":"2004","journal-title":"Technical Digest"},{"key":"1","first-page":"109","article-title":"a new alternative for temporary wafer mounting","author":"mould","year":"2002","journal-title":"GaAs MANTECH Technical Digest"},{"year":"0","key":"4"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306571.pdf?arnumber=5306571","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T04:17:16Z","timestamp":1489897036000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306571\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306571","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}