{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,16]],"date-time":"2025-06-16T14:52:39Z","timestamp":1750085559266},"reference-count":22,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306575","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-5","source":"Crossref","is-referenced-by-count":74,"title":["Impact of 3D design choices on manufacturing cost"],"prefix":"10.1109","author":[{"given":"Dimitrios","family":"Velenis","sequence":"first","affiliation":[]},{"given":"Michele","family":"Stucchi","sequence":"additional","affiliation":[]},{"given":"Erik Jan","family":"Marinissen","sequence":"additional","affiliation":[]},{"given":"Bart","family":"Swinnen","sequence":"additional","affiliation":[]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"19","DOI":"10.1109\/12.364534"},{"doi-asserted-by":"publisher","key":"22","DOI":"10.1109\/TEST.1989.82339"},{"doi-asserted-by":"publisher","key":"17","DOI":"10.1109\/IEDM.2008.4796734"},{"doi-asserted-by":"publisher","key":"18","DOI":"10.1109\/TEST.2007.4437621"},{"doi-asserted-by":"publisher","key":"15","DOI":"10.1109\/IEDM.2006.346786"},{"doi-asserted-by":"publisher","key":"16","DOI":"10.1143\/JJAP.45.3030"},{"doi-asserted-by":"publisher","key":"13","DOI":"10.1109\/JPROC.2008.2007471"},{"doi-asserted-by":"publisher","key":"14","DOI":"10.1109\/ASPDAC.2009.4796486"},{"doi-asserted-by":"publisher","key":"11","DOI":"10.1143\/JJAP.47.2801"},{"key":"12","doi-asserted-by":"crossref","first-page":"212","DOI":"10.1109\/ICCAD.2007.4397268","article-title":"extending systems-on-chip to the third dimension: performance, cost and technological tradeoffs","author":"weerasekera","year":"2007","journal-title":"Computer-Aided Design 2007 ICCAD 2007 IEEE\/ACM International Conference on"},{"key":"21","first-page":"57","article-title":"logic bist with scan chain segmentation","author":"lai","year":"2004","journal-title":"Test Conference 2004 Proceedings ITC 2004 International"},{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/IITC.2006.1648629"},{"doi-asserted-by":"publisher","key":"20","DOI":"10.1109\/TEST.1996.556959"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1109\/TNANO.2003.808515"},{"year":"2008","journal-title":"I t r s 2008 edition","key":"1"},{"key":"10","article-title":"wire bonding solutions for 3-d stacked die packages","author":"babinetz","year":"2003","journal-title":"Electronics Manufacturing Engineering"},{"doi-asserted-by":"publisher","key":"7","DOI":"10.1109\/DTIP.2008.4752966"},{"year":"2009","author":"pavlidis","journal-title":"Three-Dimensional Integrated Circuit Design","key":"6"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1109\/JPROC.2006.873612"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1109\/MDT.2005.136"},{"doi-asserted-by":"publisher","key":"9","DOI":"10.1109\/VTSA.2006.251113"},{"doi-asserted-by":"publisher","key":"8","DOI":"10.1109\/ISSCC.2005.1494016"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306575.pdf?arnumber=5306575","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T01:28:06Z","timestamp":1497835686000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306575\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":22,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306575","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}