{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:14:30Z","timestamp":1730193270138,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306578","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T13:42:09Z","timestamp":1257428529000},"page":"1-8","source":"Crossref","is-referenced-by-count":4,"title":["3-D thin chip integration technology - from technology development to application"],"prefix":"10.1109","author":[{"given":"T.","family":"Fritzsch","sequence":"first","affiliation":[{"name":"Fraunhofer IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany"}]},{"given":"R.","family":"Mrossko","sequence":"additional","affiliation":[{"name":"Fraunhofer IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany"}]},{"given":"T.","family":"Baumgartner","sequence":"additional","affiliation":[{"name":"Fraunhofer IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany"}]},{"given":"M.","family":"Toepper","sequence":"additional","affiliation":[{"name":"Fraunhofer IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany"}]},{"given":"M.","family":"Klein","sequence":"additional","affiliation":[{"name":"Fraunhofer IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany"}]},{"given":"J.","family":"Wolf","sequence":"additional","affiliation":[{"name":"Fraunhofer IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany"}]},{"given":"B.","family":"Wunderle","sequence":"additional","affiliation":[{"name":"Fraunhofer IZM, Gustav Meyer Allee 25, 13355 Berlin, Germany"}]},{"given":"H.","family":"Reichl","sequence":"additional","affiliation":[{"name":"Technische Universit\u00e4t Berlin, Gustav-Meyer Allee 25, 13355, Germany"}]}],"member":"263","reference":[{"key":"3","article-title":"wafer-level 3-d system integration","author":"ramm","year":"2008","journal-title":"3-D IC Integration Technology and Applications"},{"year":"0","key":"2"},{"doi-asserted-by":"publisher","key":"1","DOI":"10.1109\/6040.846640"},{"key":"7","article-title":"a 3-d packaging concept for cost effective packaging of mems and asic on wafer level","author":"baumgartner","year":"2009","journal-title":"2009 European Microelectronics and Packaging Conference EMPC"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1109\/3DIC.2009.5306591"},{"key":"5","first-page":"1","article-title":"body surface backed flexible antennas and 3d si-level integrated wireless sensor nodes for 17 ghz wireless body area networks","author":"rydberg","year":"2009","journal-title":"2009 2nd IET Seminar on Antennas and Propagation for Body-Centric Wireless Communications IET"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1109\/ECTC.2009.5074037"},{"key":"8","article-title":"thermo-mechanical reliability of 3d-integrated structures in stacked silicon. (invited paper)","volume":"970","author":"wunderle","year":"2007","journal-title":"Mater Res Soc Symp Proc"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306578.pdf?arnumber=5306578","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,6,8]],"date-time":"2021-06-08T01:02:08Z","timestamp":1623114128000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/5306578\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306578","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}