{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T04:32:48Z","timestamp":1725769968182},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306584","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-5","source":"Crossref","is-referenced-by-count":8,"title":["A capacitive coupling interface with high sensitivity for wireless wafer testing"],"prefix":"10.1109","author":[{"given":"Gil-Su","family":"Kim","sequence":"first","affiliation":[]},{"given":"Makoto","family":"Takamiya","sequence":"additional","affiliation":[]},{"given":"Takayasu","family":"Sakurai","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.914716"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.886554"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/4.557640"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2005.1584004"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2007.373447"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.859881"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.848030"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2012365"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9781139166980"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.914762"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306584.pdf?arnumber=5306584","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T06:09:51Z","timestamp":1489817391000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306584\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306584","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}