{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T08:55:24Z","timestamp":1725440124363},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306590","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T13:42:09Z","timestamp":1257428529000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Development of feed-forward design system for rapid SiP design"],"prefix":"10.1109","author":[{"given":"Tomokatsu","family":"Mizukusa","sequence":"first","affiliation":[]},{"given":"Tamio","family":"Nagano","sequence":"additional","affiliation":[]},{"given":"Yasuo","family":"Shimizu","sequence":"additional","affiliation":[]},{"given":"Kazuyuki","family":"Sakata","sequence":"additional","affiliation":[]},{"given":"Kazuo","family":"Kato","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977517"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007463"},{"journal-title":"International Technology Roadmap for Semiconductor","year":"2007","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2008.4684464"},{"key":"6","first-page":"55","article-title":"effects of on-package decouping capacitors on the simultaneous switching noise","author":"chou","year":"1995","journal-title":"EPEP1995"},{"key":"5","first-page":"109","article-title":"a simultaneous switching noise analysis of a high speed memory module including the test environments and systemlelvel models","author":"choi","year":"1997","journal-title":"EPEP1997"},{"key":"4","first-page":"413","article-title":"design methodology of renesas sip","author":"otake","year":"2008","journal-title":"3D-SiC 2008"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306590.pdf?arnumber=5306590","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,18]],"date-time":"2017-03-18T02:20:00Z","timestamp":1489803600000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306590\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306590","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}