{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T11:36:46Z","timestamp":1725622606513},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306593","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-7","source":"Crossref","is-referenced-by-count":12,"title":["3-D memory organization and performance analysis for multi-processor network-on-chip architecture"],"prefix":"10.1109","author":[{"given":"Awet Yemane","family":"Weldezion","sequence":"first","affiliation":[]},{"given":"Zhonghai","family":"Lu","sequence":"additional","affiliation":[]},{"given":"Roshan","family":"Weerasekera","sequence":"additional","affiliation":[]},{"given":"Hannu","family":"Tenhunen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","article-title":"examination of delay and signal integrity metrics in tsvs","author":"grange","year":"2009","journal-title":"Workshop Notes Design Automation and Test in Europe Conference (DATE)"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/NOCS.2009.5071459"},{"key":"10","first-page":"21","article-title":"design and implementation of a hot-potato switch in a network on chip","author":"nillson","year":"1911","journal-title":"Me?moire Department of Microelectronics and Information Technology Royal Institute of Technology IMIT\/LECS"},{"journal-title":"Wafer Level 3-D ICs Process Technology","first-page":"1","year":"2008","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt:20050068"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1016\/j.sysarc.2007.01.010"},{"year":"0","key":"5"},{"year":"0","key":"4"},{"journal-title":"Networks on Chip","first-page":"7","year":"2003","key":"9"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/DSD.2006.73"},{"key":"11","first-page":"347","article-title":"3-d packaging technology overview and mass memory applications","author":"terrill","year":"1996","journal-title":"IEEE Aerospace Applications Conference"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4757-4841-3"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306593.pdf?arnumber=5306593","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,19]],"date-time":"2017-03-19T04:37:42Z","timestamp":1489898262000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306593\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306593","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}