{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T09:13:50Z","timestamp":1729674830612,"version":"3.28.0"},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009,9]]},"DOI":"10.1109\/3dic.2009.5306597","type":"proceedings-article","created":{"date-parts":[[2009,11,5]],"date-time":"2009-11-05T18:42:09Z","timestamp":1257446529000},"page":"1-8","source":"Crossref","is-referenced-by-count":2,"title":["3D integrated circuits for lab-on-chip applications"],"prefix":"10.1109","author":[{"given":"Samuel J.","family":"Dickerson","sequence":"first","affiliation":[]},{"given":"Steven P.","family":"Levitan","sequence":"additional","affiliation":[]},{"given":"Donald M.","family":"Chiarulli","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1007\/s002490100144"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9780511574498"},{"journal-title":"MITLL Low-Power FDSOI CMOS Process Design Guide","year":"2008","key":"1"},{"key":"4","doi-asserted-by":"crossref","first-page":"985","DOI":"10.1088\/0305-4470\/22\/8\/014","article-title":"dielectrophoresis:a spherical shell model 1989","volume":"22","author":"turcu","year":"0","journal-title":"J Phys A Math Gen"}],"event":{"name":"2009 IEEE International Conference on 3D System Integration (3DIC)","start":{"date-parts":[[2009,9,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2009,9,30]]}},"container-title":["2009 IEEE International Conference on 3D System Integration"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5290624\/5306519\/05306597.pdf?arnumber=5306597","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T01:28:06Z","timestamp":1497835686000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5306597\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009,9]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/3dic.2009.5306597","relation":{},"subject":[],"published":{"date-parts":[[2009,9]]}}}