{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T22:42:33Z","timestamp":1725489753672},"reference-count":20,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,11]]},"DOI":"10.1109\/3dic.2010.5751428","type":"proceedings-article","created":{"date-parts":[[2011,4,18]],"date-time":"2011-04-18T13:44:45Z","timestamp":1303134285000},"page":"1-6","source":"Crossref","is-referenced-by-count":24,"title":["Cost effectiveness of 3D integration options"],"prefix":"10.1109","author":[{"given":"Dimitrios","family":"Velenis","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Erik Jan","family":"Marinissen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eric","family":"Beyne","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.47.2801"},{"key":"ref11","doi-asserted-by":"crossref","first-page":"212","DOI":"10.1109\/ICCAD.2007.4397268","article-title":"Extending systems-on-chip to the third dimension: performance, cost and technological tradeoffs","author":"weerasekera","year":"2007","journal-title":"Computer-Aided Design 2007 ICCAD 2007 IEEE\/ACM International Conference on"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007471"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434016"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796486"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2006.346786"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796734"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306575"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ETSYM.2010.5512785"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977342"},{"journal-title":"Three-Dimensional Integrated Circuit Design","year":"2009","author":"pavlidis","key":"ref4"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.873612"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DTIP.2008.4752966"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MAHC.2006.45"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/VTSA.2006.251113"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2005.1494016"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2006.1648629"},{"key":"ref9","article-title":"Wire bonding solutions for 3-D stacked die packages","author":"babinetz","year":"2003","journal-title":"Electronics Manufacturing Engineering"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2009.5355573"}],"event":{"name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2010,11,16]]},"location":"Munich, Germany","end":{"date-parts":[[2010,11,18]]}},"container-title":["2010 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5742028\/5751414\/05751428.pdf?arnumber=5751428","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T22:50:09Z","timestamp":1497912609000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5751428\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,11]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/3dic.2010.5751428","relation":{},"subject":[],"published":{"date-parts":[[2010,11]]}}}