{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,1]],"date-time":"2026-10-01T22:04:49Z","timestamp":1790892289399,"version":"4.1.0"},"reference-count":28,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,11]]},"DOI":"10.1109\/3dic.2010.5751446","type":"proceedings-article","created":{"date-parts":[[2011,4,18]],"date-time":"2011-04-18T09:44:45Z","timestamp":1303119885000},"page":"1-6","source":"Crossref","is-referenced-by-count":17,"title":["A 3D SoC design for H.264 application with on-chip DRAM stacking"],"prefix":"10.1109","author":[{"given":"Tao","family":"Zhang","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kui","family":"Wang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yi","family":"Feng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yan","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qun","family":"Li","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Bing","family":"Shao","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jing","family":"Xie","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaodi","family":"Song","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lian","family":"Duan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuan","family":"Xie","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xu","family":"Cheng","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Youn-Long","family":"Lin","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034078"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2010.5416628"},{"key":"ref12","article-title":"ATLAS: A Scalable and High-performance Scheduling Algorithm for Multiple Memory Controllers","author":"kim","year":"2010","journal-title":"in Proceedings of the International Conference on High Performance Computer Architecture"},{"key":"ref13","article-title":"AMBA Specification","year":"1999","journal-title":"ARM"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/1118299.1118471"},{"key":"ref15","year":"0","journal-title":"Introduction to USB On-The-Go"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/s11390-010-9317-1"},{"key":"ref17","year":"0","journal-title":"Tczzaron"},{"key":"ref18","year":"0","journal-title":"Synopsys"},{"key":"ref19","doi-asserted-by":"crossref","first-page":"668","DOI":"10.1145\/1391469.1391642","article-title":"design and cad for 3d integrated circuits","author":"franzon","year":"2008","journal-title":"2008 45th ACM\/IEEE Design Automation Conference DAC"},{"key":"ref28","first-page":"98","article-title":"An 80-Tile 1.28TFLOPS Network-on-Chip in 65nm CMOS","author":"vangal","year":"2007","journal-title":"IEEE Int Solid-State Circuits Conf"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796486"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ASAP.2009.11"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.125"},{"key":"ref6","first-page":"589","article-title":"System-in-Package Technology: Opportunities and Chal-lenges","volume":"0","author":"fontanelli","year":"2008","journal-title":"International Symposium on Quality Electronic Design"},{"key":"ref5","year":"2009"},{"key":"ref8","author":"babinetz","year":"0","journal-title":"Wire Bonding Solutions for 3-D Stacked Die Packages"},{"key":"ref7","year":"2009","journal-title":"International Technology Roadmap for Semiconductors"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796519"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2008.15"},{"key":"ref1","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4419-0784-4","author":"xie","year":"2010","journal-title":"Three-Dimensional Integrated Circuit Design EDA Design and Microarchitectures"},{"key":"ref20","year":"0","journal-title":"Cadence"},{"key":"ref22","author":"garrou","year":"2008","journal-title":"3D Integration Technology and Applications"},{"key":"ref21","year":"2008"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"ref23","article-title":"MPW Design Guide","year":"2010","journal-title":"Tezzaron"},{"key":"ref26","article-title":"Preliminary Specification for 8-port Memory","year":"2010","journal-title":"Tezzaron"},{"key":"ref25","doi-asserted-by":"crossref","first-page":"51","DOI":"10.1145\/1629911.1629928","article-title":"design automation for a 3dic fft processor for synthetic aperture radar: a case study","author":"thorolfsson","year":"2009","journal-title":"2009 46th ACM\/IEEE Design Automation Conference dac"}],"event":{"name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","location":"Munich, Germany","start":{"date-parts":[[2010,11,16]]},"end":{"date-parts":[[2010,11,18]]}},"container-title":["2010 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5742028\/5751414\/05751446.pdf?arnumber=5751446","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T18:50:09Z","timestamp":1497898209000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5751446\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,11]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/3dic.2010.5751446","relation":{},"subject":[],"published":{"date-parts":[[2010,11]]}}}