{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:14:37Z","timestamp":1730193277443,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,11]]},"DOI":"10.1109\/3dic.2010.5751457","type":"proceedings-article","created":{"date-parts":[[2011,4,18]],"date-time":"2011-04-18T09:44:45Z","timestamp":1303119885000},"page":"1-4","source":"Crossref","is-referenced-by-count":4,"title":["TSV development for miniaturized MEMS acceleration switch"],"prefix":"10.1109","author":[{"given":"Nicolas","family":"Lietaer","sequence":"first","affiliation":[]},{"given":"Anand","family":"Summanwar","sequence":"additional","affiliation":[]},{"given":"Thor","family":"Bakke","sequence":"additional","affiliation":[]},{"given":"Maaike","family":"Taklo","sequence":"additional","affiliation":[]},{"given":"Per","family":"Dalsjo","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"year":"0","author":"larmer","key":"ref4"},{"key":"ref3","first-page":"4e","article-title":"3D MEMS and IC integration","volume":"1112","author":"taklo","year":"2009","journal-title":"Mater Res Soc Symp Proc"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"63","DOI":"10.1557\/PROC-546-63","article-title":"Benefits of process parameter ramping during the plasma etching ofhigh aspect ratio silicon structures","volume":"546","author":"hopkins","year":"1999","journal-title":"Materials Research Society Symposium - Proceedings"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1116\/1.1495505"},{"key":"ref2","first-page":"10","article-title":"3D Interconnect Technologies for Advanced MEMS\/NEMS Applications","volume":"25","author":"lietaer","year":"2009","journal-title":"ECS Trans"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2010.02.008"}],"event":{"name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2010,11,16]]},"location":"Munich","end":{"date-parts":[[2010,11,18]]}},"container-title":["2010 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5742028\/5751414\/05751457.pdf?arnumber=5751457","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T02:09:33Z","timestamp":1581041373000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/5751457\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,11]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/3dic.2010.5751457","relation":{},"subject":[],"published":{"date-parts":[[2010,11]]}}}