{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T22:16:27Z","timestamp":1775081787686,"version":"3.50.1"},"reference-count":1,"publisher":"IEEE","license":[{"start":{"date-parts":[[2010,11,1]],"date-time":"2010-11-01T00:00:00Z","timestamp":1288569600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2010,11,1]],"date-time":"2010-11-01T00:00:00Z","timestamp":1288569600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,11]]},"DOI":"10.1109\/3dic.2010.5751470","type":"proceedings-article","created":{"date-parts":[[2011,4,18]],"date-time":"2011-04-18T09:44:45Z","timestamp":1303119885000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Development of high accuracy wafer thinning and pickup technology for thin wafer"],"prefix":"10.1109","author":[{"given":"Chuichi","family":"Miyazaki","sequence":"first","affiliation":[{"name":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"}]},{"given":"Haruo","family":"Shimamoto","sequence":"additional","affiliation":[{"name":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"}]},{"given":"Toshihide","family":"Uematsu","sequence":"additional","affiliation":[{"name":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"}]},{"given":"Yoshiyuki","family":"Abe","sequence":"additional","affiliation":[{"name":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"}]},{"given":"Kosuke","family":"Kitaichi","sequence":"additional","affiliation":[{"name":"Association of Super-Advanced Electronics Technology (ASET), Renesas Technology Corp., 20-1, Josuihon-cho 5-chome, Kodaira-shi, Tokyo 187-8588, Japan"}]},{"given":"Tadahiro","family":"Morifuji","sequence":"additional","affiliation":[{"name":"Association of Super-Advanced Electronics Technology (ASET), ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan"}]},{"given":"Shoji","family":"Yasunaga","sequence":"additional","affiliation":[{"name":"Association of Super-Advanced Electronics Technology (ASET), ROHM Co., Ltd., 21 Saiin Mizosaki-cho, Ukyo-ku, Kyoto 615-8585, Japan"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Development of wafer thinning and dicing technology for thin wafef","author":"miyazaki","year":"2009","journal-title":"3D-IC 2009"}],"event":{"name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","location":"Munich, Germany","start":{"date-parts":[[2010,11,16]]},"end":{"date-parts":[[2010,11,18]]}},"container-title":["2010 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5742028\/5751414\/05751470.pdf?arnumber=5751470","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T20:10:23Z","timestamp":1775074223000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/5751470\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,11]]},"references-count":1,"URL":"https:\/\/doi.org\/10.1109\/3dic.2010.5751470","relation":{},"subject":[],"published":{"date-parts":[[2010,11]]}}}