{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:14:42Z","timestamp":1730193282204,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,11]]},"DOI":"10.1109\/3dic.2010.5751484","type":"proceedings-article","created":{"date-parts":[[2011,4,18]],"date-time":"2011-04-18T09:44:45Z","timestamp":1303119885000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["Pre bonding metrology solutions for 3D integration"],"prefix":"10.1109","author":[{"given":"Gregory","family":"Riou","sequence":"first","affiliation":[]},{"given":"Gweltaz","family":"Gaudin","sequence":"additional","affiliation":[]},{"given":"Didier","family":"Landru","sequence":"additional","affiliation":[]},{"given":"Catherine","family":"Tempesta","sequence":"additional","affiliation":[]},{"given":"Ionut","family":"Radu","sequence":"additional","affiliation":[]},{"given":"Mariam","family":"Sadaka","sequence":"additional","affiliation":[]},{"given":"Kevin","family":"Winstel","sequence":"additional","affiliation":[]},{"given":"Emily","family":"Kinser","sequence":"additional","affiliation":[]},{"given":"Robert","family":"Hannon","sequence":"additional","affiliation":[]},{"given":"Boris V.","family":"Kamenev","sequence":"additional","affiliation":[]},{"given":"Michael","family":"Darwin","sequence":"additional","affiliation":[]},{"given":"Robert","family":"Sachs","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"1","article-title":"Transparent film profiling and analysis by interference microscopy","volume":"7064","author":"de groot","year":"2008","journal-title":"SPIE"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1364\/AO.39.002107"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1117\/12.782836"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.2062999"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1364\/AO.41.004571"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1117\/12.194308"}],"event":{"name":"2010 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2010,11,16]]},"location":"Munich, Germany","end":{"date-parts":[[2010,11,18]]}},"container-title":["2010 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5742028\/5751414\/05751484.pdf?arnumber=5751484","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T00:20:39Z","timestamp":1490055639000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5751484\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,11]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/3dic.2010.5751484","relation":{},"subject":[],"published":{"date-parts":[[2010,11]]}}}