{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T22:36:22Z","timestamp":1725489382959},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6262964","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-6","source":"Crossref","is-referenced-by-count":2,"title":["In-tier diagnosis of power domains in 3D TSV ICs"],"prefix":"10.1109","author":[{"given":"Y.","family":"Araga","sequence":"first","affiliation":[]},{"given":"M.","family":"Nagata","sequence":"additional","affiliation":[]},{"given":"G.","family":"Van der Plas","sequence":"additional","affiliation":[]},{"family":"Jaemin Kim","sequence":"additional","affiliation":[]},{"given":"N.","family":"Minas","sequence":"additional","affiliation":[]},{"given":"P.","family":"Marchal","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Travaly","sequence":"additional","affiliation":[]},{"given":"M.","family":"Libois","sequence":"additional","affiliation":[]},{"given":"A.","family":"La Manna","sequence":"additional","affiliation":[]},{"family":"Wenqi Zhang","sequence":"additional","affiliation":[]},{"given":"E.","family":"Beyne","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434016"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796821"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306559"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796763"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2010.5537814"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06262964.pdf?arnumber=6262964","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T20:43:58Z","timestamp":1490129038000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6262964\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6262964","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}