{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,24]],"date-time":"2025-08-24T00:01:17Z","timestamp":1755993677097,"version":"3.44.0"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2012,1,1]],"date-time":"2012-01-01T00:00:00Z","timestamp":1325376000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2012,1,1]],"date-time":"2012-01-01T00:00:00Z","timestamp":1325376000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6262966","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["A miniaturized heterogeneous wireless sensor node in 3DIC"],"prefix":"10.1109","author":[{"given":"Xin","family":"Liu","sequence":"first","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]},{"given":"Lei","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of ECE, National University of Singapore, Singapore, 117576"}]},{"given":"Mini","family":"Jayakrishnan","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]},{"given":"Jingjing","family":"Lan","sequence":"additional","affiliation":[{"name":"School of EEE, Nanyang Technology University, Singapore, 639798"}]},{"given":"Hongyu","family":"Li","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]},{"given":"Chong Ser","family":"Choong","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]},{"given":"M. Kumara-samy","family":"Raja","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]},{"given":"Yongxin","family":"Guo","sequence":"additional","affiliation":[{"name":"Department of ECE, National University of Singapore, Singapore, 117576"}]},{"given":"Wang Ling","family":"Goh","sequence":"additional","affiliation":[{"name":"School of EEE, Nanyang Technology University, Singapore, 639798"}]},{"given":"Jin","family":"He","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]},{"given":"Shan","family":"Gao","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]},{"given":"Minkyu","family":"Je","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics, 11 Science Park Road, Singapre Science Park II, Singapore, 117685"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2010.5617464"},{"key":"2","first-page":"74","article-title":"A Larger Stacked Layer Number Scalable TSV-based 3D-SRAM for High-Performance Universal-Memory-Capacity 3D-IC Platforms","author":"chang","year":"2011","journal-title":"Symp VLSI Tech"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2009.5280818"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2010.5716552"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4550027"},{"journal-title":"3D ICs with TSVs Design Challenges and Requirements","year":"0","key":"4"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2010.5703319"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka, Japan","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06262966.pdf?arnumber=6262966","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,23]],"date-time":"2025-08-23T00:14:29Z","timestamp":1755908069000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6262966\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6262966","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}