{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:14:57Z","timestamp":1730193297559,"version":"3.28.0"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6262970","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["W\/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress"],"prefix":"10.1109","author":[{"given":"Mariappan","family":"Murugesan","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hideto","family":"Hashiguchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Harufumi","family":"Kobayashi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takafumi","family":"Fukushima","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tetsu","family":"Tanaka","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mitsumasa","family":"Koyanagi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/IEDM.2009.5424348"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1109\/IEDM.2010.5703279"},{"doi-asserted-by":"publisher","key":"1","DOI":"10.1109\/JPROC.2008.2007463"},{"key":"7","first-page":"43","volume":"110","author":"murugesan","year":"2011","journal-title":"Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1109\/IEDM.2011.6131503"},{"key":"5","first-page":"482","article-title":"Tungsten Through-Si Via (TSV)Technology for Three-Dimensional LSIs","author":"kikuchi","year":"2007","journal-title":"Int Conf Solid State Devices and Materials"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1143\/JJAP.45.3024"},{"doi-asserted-by":"publisher","key":"9","DOI":"10.1109\/IEDM.2010.5703283"},{"doi-asserted-by":"publisher","key":"8","DOI":"10.7567\/SSDM.2011.C-8-2"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06262970.pdf?arnumber=6262970","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T20:39:38Z","timestamp":1490128778000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6262970\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6262970","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}