{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T20:38:15Z","timestamp":1725395895176},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6262971","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures"],"prefix":"10.1109","author":[{"given":"Osamu","family":"Nakatsuka","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hideki","family":"Kitada","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Young Suk","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yoriko","family":"Mizushima","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tomoji","family":"Nakamura","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takayuki","family":"Ohba","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shigeaki","family":"Zaima","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1989.74183"},{"key":"2","doi-asserted-by":"crossref","first-page":"488","DOI":"10.1109\/IEDM.1986.191227","article-title":"concept and basic technologies for 3-d ic structure","author":"akasaka","year":"1986","journal-title":"1986 International Electron Devices Meeting"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1088\/1742-6596\/241\/1\/012014"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1063\/1.329392"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2010.5510710"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424348"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2009.5090354"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2009.07.006"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1063\/1.2336085"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1063\/1.362678"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.50.05ED03"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06262971.pdf?arnumber=6262971","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T19:09:07Z","timestamp":1497985747000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6262971\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6262971","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}