{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T19:06:07Z","timestamp":1725390367830},"reference-count":5,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6262981","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Selection of underfill material in Cu hybrid bonding and its effect on the transistor keep-out-zone"],"prefix":"10.1109","author":[{"given":"D. F.","family":"Lim","sequence":"first","affiliation":[]},{"given":"K. C.","family":"Leong","sequence":"additional","affiliation":[]},{"given":"C. S.","family":"Tan","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","first-page":"78","author":"gueguen","year":"0","journal-title":"Electronic Components and Technology Conference (2010)"},{"key":"2","first-page":"11","author":"jourdain","year":"0","journal-title":"Electronic Components and Technology Conference (2009)"},{"key":"1","first-page":"1","author":"liu","year":"0","journal-title":"IEEE International Electron Devices Meeting (2008)"},{"key":"5","first-page":"107","author":"kitada","year":"0","journal-title":"International Interconnect Technology Conference (2009)"},{"key":"4","first-page":"249","author":"okoro","year":"0","journal-title":"Electronic Components and Technology Conference (2007)"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06262981.pdf?arnumber=6262981","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T21:53:05Z","timestamp":1490133185000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6262981\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6262981","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}