{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T00:01:12Z","timestamp":1725667272120},"reference-count":3,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6262990","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-4","source":"Crossref","is-referenced-by-count":8,"title":["Vias-last process technology for thick 2.5D Si interposers"],"prefix":"10.1109","author":[{"given":"Erik","family":"Vick","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Scott","family":"Goodwin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Garry","family":"Cunnigham","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dorota S.","family":"Temple","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","article-title":"Power savings of embedded computing modules (ECMs) over FR-4 implementations","author":"blaker","year":"2009","journal-title":"ElectroIQ com Advanced Packaging"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751443"},{"key":"1","article-title":"Electrical Demonstration of TSV Interconnects and Multilevel Metallization for 3D Si Interposer Applications","author":"vick","year":"0","journal-title":"Proc of IMAPS 43rd International Symposium on Microelectronics Oct 30-Nov 4 2010"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06262990.pdf?arnumber=6262990","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T22:10:50Z","timestamp":1490134250000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6262990\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":3,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6262990","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}