{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T22:29:05Z","timestamp":1725488945020},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6262998","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Mechanical and electrical reliability of copper interconnections for 3DIC"],"prefix":"10.1109","author":[{"given":"Naoki","family":"Saito","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naokazu","family":"Murata","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kinji","family":"Tamakawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ken","family":"Suzuki","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hideo","family":"Miura","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.2472\/jsms.56.907"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ESIME.2007.360064"},{"journal-title":"International Technology Roadmap for Semiconductor","year":"2007","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1115\/IPACK2011-52048"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2009.2032768"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1116\/1.1368673"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1016\/S1359-6454(00)00169-5"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06262998.pdf?arnumber=6262998","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T20:39:42Z","timestamp":1490128782000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6262998\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6262998","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}