{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T07:30:14Z","timestamp":1729668614758,"version":"3.28.0"},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6263001","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T14:48:43Z","timestamp":1345646923000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Mechanical reliability of Cu\/low-k interconnects and underfill"],"prefix":"10.1109","author":[{"given":"Taeshik","family":"Yoon","sequence":"first","affiliation":[]},{"given":"Inhwa","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Taek-Soo","family":"Kim","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.1999.776299"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.1996.517439"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1016\/S0013-7944(99)00078-8"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1021\/nl101169s"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1016\/j.actamat.2009.06.022"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2006.346781"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1021\/nl901138p"},{"key":"11","doi-asserted-by":"crossref","first-page":"64108","DOI":"10.1063\/1.2894727","article-title":"Depth Dependence of UV Curing of Organosilicate Low-k Thin Films","volume":"103","author":"kim","year":"2008","journal-title":"Journal of Applied Physics"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1063\/1.2999637"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1063\/1.1427139"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1557\/JMR.2001.0037"},{"key":"22","doi-asserted-by":"publisher","DOI":"10.1016\/S1359-6454(02)00072-1"},{"key":"23","doi-asserted-by":"publisher","DOI":"10.1016\/S0013-7944(03)00046-8"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1016\/j.actamat.2007.02.012"},{"year":"0","key":"25"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2005.1493207"},{"key":"2","first-page":"433","article-title":"UV, E-beam, and Thermal Curing of Low-k Organosilicates: Effects on Glass Structure and Mechanical Properties","author":"gage","year":"2008","journal-title":"Proc of Advanced Metallization Conf 2007"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1016\/j.actamat.2006.10.008"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1063\/1.3190198"},{"key":"7","doi-asserted-by":"crossref","first-page":"43513","DOI":"10.1063\/1.2968438","article-title":"Effects of UV cure on glass structure and fracture properties of nanoporous carbon-doped oxide thin films","volume":"104","author":"gage","year":"2008","journal-title":"Journal of Applied Physics"},{"key":"6","first-page":"455","article-title":"Depth Dependence of UV Curing of Organosilicate Low-k Thin Films","author":"kim","year":"2008","journal-title":"Proc of Advanced Metallization Conf 2007"},{"key":"5","first-page":"389","article-title":"Non-Uniform UV Curing Effects on Mechanical and Fracture Properties of Organosilicate Low-k Thin Films","author":"kim","year":"2007","journal-title":"Proceedings of 2006 Advanced Metallization Conference"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2005.1499989"},{"key":"9","doi-asserted-by":"crossref","first-page":"53511","DOI":"10.1063\/1.2178393","article-title":"Short-ranged structural rearrangement and enhancement of mechanical properties of organosilicate glasses induced by ultraviolet radiation","volume":"99","author":"iacopi","year":"2006","journal-title":"Journal of Applied Physics"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1016\/j.actamat.2008.06.007"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06263001.pdf?arnumber=6263001","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T23:09:10Z","timestamp":1498000150000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6263001\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6263001","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}