{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,10]],"date-time":"2026-05-10T02:53:42Z","timestamp":1778381622979,"version":"3.51.4"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6263005","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["Hot spots suppression by high thermal conductivity film in thin-sub strate CMOS ICs for 3D integration"],"prefix":"10.1109","author":[{"given":"Fumiki","family":"Kato","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Katsuya","family":"Kikuchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroshi","family":"Nakagawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Masahiro","family":"Aoyagi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.40.3032"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/40.710867"},{"key":"10","first-page":"235","article-title":"Ultra-Thin High-Density Packaging Substrate for High-Performance CSP and SiP","author":"shimoto","year":"2003","journal-title":"Proceedings of the 2003 IMAPS"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.494.0725"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2006.39"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.1997.639607"},{"key":"5","author":"pierret","year":"1996","journal-title":"Semiconductor Device Fundamentals"},{"key":"4","author":"taur","year":"1998","journal-title":"Fundamentals of Modern VLSI Devices"},{"key":"9","first-page":"74","article-title":"Investigation of Tier-swapping to Improve the Thermal Profile of Memory-on-Logic 3DICs","author":"melamed","year":"2010","journal-title":"Proceedings of the 16th International Worshop on THERMal INvestigations of ICs and Systems"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424433"},{"key":"11","first-page":"301","article-title":"High Thermal Conductivity Multilayer Nanofilms for Reducing Thermal Hot Spots in LSI devices","author":"kato","year":"2011","journal-title":"Proceedings of International Conference on Electronics Packaging 2011"},{"key":"12","first-page":"68","volume":"2","author":"clerk maxwell","year":"1892","journal-title":"A Treatise on Electricity and Magnetism"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","location":"Osaka","start":{"date-parts":[[2012,1,31]]},"end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06263005.pdf?arnumber=6263005","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T22:02:11Z","timestamp":1490133731000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6263005\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6263005","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}