{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T21:28:23Z","timestamp":1725485303485},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6263009","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T14:48:43Z","timestamp":1345646923000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications"],"prefix":"10.1109","author":[{"given":"Xiaowu","family":"Zhang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ranjan","family":"Rajoo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"F. X.","family":"Che","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"C. S.","family":"Selvanayagam","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"W. K.","family":"Choi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shan","family":"Gao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G. Q.","family":"Lo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"D.-L.","family":"Kwong","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"15","DOI":"10.1109\/ECTC.2009.5074036"},{"doi-asserted-by":"publisher","key":"13","DOI":"10.1109\/ECTC.2009.5074032"},{"doi-asserted-by":"publisher","key":"14","DOI":"10.1109\/ECTC.2008.4550027"},{"doi-asserted-by":"publisher","key":"11","DOI":"10.1109\/ECTC.2007.373945"},{"doi-asserted-by":"publisher","key":"12","DOI":"10.1109\/TADVP.2009.2021661"},{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/ECTC.2007.373865"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1147\/rd.494.0725"},{"doi-asserted-by":"publisher","key":"1","DOI":"10.1109\/JPROC.2008.2007458"},{"doi-asserted-by":"publisher","key":"10","DOI":"10.1109\/ECTC.2008.4550075"},{"doi-asserted-by":"publisher","key":"7","DOI":"10.1109\/ECTC.2007.373805"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1147\/JRD.2008.5388558"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1109\/ECTC.2006.1645754"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1109\/ECTC.2007.373862"},{"doi-asserted-by":"publisher","key":"9","DOI":"10.1109\/ECTC.2007.373893"},{"doi-asserted-by":"publisher","key":"8","DOI":"10.1109\/ECTC.2008.4550025"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06263009.pdf?arnumber=6263009","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T02:05:57Z","timestamp":1490148357000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6263009\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6263009","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}