{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:15:13Z","timestamp":1730193313751,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6263023","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["A 3D-Integration method to compensate output voltage degradation of boost converter for compact Solid-State-Drives"],"prefix":"10.1109","author":[{"given":"Teruyoshi","family":"Hatanaka","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Koh","family":"Johguchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ken","family":"Takeuchi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","first-page":"200","article-title":"4-Times Faster Rising VPASS (10 V), 15% Lower Power VPGM (20 V), Wide Output Voltage Range Voltage Generator System for 4-Times Faster 3D-integrated Solid-State Drives","author":"hatanaka","year":"2011","journal-title":"IEEE Symp VLSI Circuits"},{"key":"2","first-page":"233","article-title":"A 60% higher write speed, 4.2Gbps, 24-channel 3D-solid state drive (SSD) with NAND flash channel number detector and intelligent program-voltage booster","author":"hatanaka","year":"2010","journal-title":"IEEE Symp VLSI Circuits"},{"key":"1","first-page":"238","article-title":"A 1.8 V 30 nJ Adaptive Program-Voltage (20 V) Generator for 3D-Integrated NAND Flash SSD","author":"ishida","year":"2009","journal-title":"IEEE International Solid-State Circuits Conference"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/22.900004"},{"key":"5","first-page":"1057","article-title":"Adaptive Through-Silicon-Via Control with Clustering for 3D Solid-State-Drive Boost Converter System","author":"johguchi","year":"2011","journal-title":"Ext Abst International Conference on Solid State Devices and Materials"},{"key":"4","first-page":"268","article-title":"Through-Silicon Via Design for a 3-D Solid-State Drive System with Boost Converter in a Package","volume":"1","author":"johugchi","year":"2011","journal-title":"IEEE Trans Components Packaging and Manufacturing Technology"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06263023.pdf?arnumber=6263023","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T20:39:42Z","timestamp":1490128782000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6263023\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6263023","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}