{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,25]],"date-time":"2026-10-25T06:35:32Z","timestamp":1792910132166,"version":"4.5.0"},"reference-count":19,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6263025","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T10:48:43Z","timestamp":1345632523000},"page":"1-5","source":"Crossref","is-referenced-by-count":2,"title":["Performance evaluation of 3D stacked multi-core processors with temperature consideration"],"prefix":"10.1109","author":[{"given":"Takaaki","family":"Hanada","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hiroshi","family":"Sasaki","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Koji","family":"Inoue","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kazuaki","family":"Murakami","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"International Technology Roadmap for Semiconductors (ITRS)"},{"key":"ref2","volume-title":"intel Pentium M Data Sheet"},{"key":"ref3","volume-title":"intel Xeon 7100 Data Sheet"},{"key":"ref4","article-title":"Exploring the Design Space for 3D Clustered Architectures","volume-title":"3rd IBM Watson Conference on Interaction between Architecture, Circuits, and Compilers","author":"Awasthi"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2006.82"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2006.18"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2001.903261"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2001.912621"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501257"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2006.18"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1147160"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2008.15"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/1127908.1127915"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2007.346197"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/1283780.1283824"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2003.1206984"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/4.509850"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.1995.524546"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1145\/1148015.1148016"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","location":"Osaka","start":{"date-parts":[[2012,1,31]]},"end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06263025.pdf?arnumber=6263025","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,10,25]],"date-time":"2026-10-25T05:51:28Z","timestamp":1792907488000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6263025\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6263025","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}