{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T15:16:51Z","timestamp":1725722211434},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,1]]},"DOI":"10.1109\/3dic.2012.6263036","type":"proceedings-article","created":{"date-parts":[[2012,8,22]],"date-time":"2012-08-22T14:48:43Z","timestamp":1345646923000},"page":"1-4","source":"Crossref","is-referenced-by-count":7,"title":["Exploring AMBA AXI on-Chip interconnection for TSV-based 3D SoCs"],"prefix":"10.1109","author":[{"given":"Xiongfei","family":"Liao","sequence":"first","affiliation":[]},{"given":"Jun","family":"Zhou","sequence":"additional","affiliation":[]},{"given":"Xin","family":"Liu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"journal-title":"ARM AMBA Open Speficications","year":"2011","key":"3"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"year":"2011","key":"1"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2009.5355573"},{"key":"6","doi-asserted-by":"crossref","first-page":"70","DOI":"10.1109\/2.976921","article-title":"Networks on Chips: A New Paradigm for Component-Based MPSoC Design","author":"benini","year":"2002","journal-title":"IEEE Computer"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2003.1234350"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2007.893649"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1145\/2024716.2024718"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2009.42"}],"event":{"name":"2011 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2012,1,31]]},"location":"Osaka","end":{"date-parts":[[2012,2,2]]}},"container-title":["2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6253019\/6262941\/06263036.pdf?arnumber=6263036","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T23:09:08Z","timestamp":1498000148000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6263036\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,1]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/3dic.2012.6263036","relation":{},"subject":[],"published":{"date-parts":[[2012,1]]}}}