{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T20:13:23Z","timestamp":1725567203535},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702325","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T15:09:52Z","timestamp":1389366592000},"page":"1-4","source":"Crossref","is-referenced-by-count":5,"title":["Silicon Etch with integrated metrology for through silicon via (TSV) reveal"],"prefix":"10.1109","author":[{"given":"Laura B.","family":"Mauer","sequence":"first","affiliation":[]},{"given":"John","family":"Taddei","sequence":"additional","affiliation":[]},{"given":"Elena","family":"Lawrence","sequence":"additional","affiliation":[]},{"given":"Ramey","family":"Youssef","sequence":"additional","affiliation":[]},{"given":"Stephen P.","family":"Olson","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","article-title":"DRIE from MEMS to wafer-level packaging","author":"lea","year":"2007","journal-title":"Solid State Technology"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248922"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2012.6262987"},{"key":"4","article-title":"Silicon wafer thinning to reveal Cu TSV","author":"mauer","year":"0","journal-title":"IMAPS Conference Fountain Hills AZ March 2012"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702325.pdf?arnumber=6702325","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T13:46:57Z","timestamp":1490190417000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702325\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702325","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}