{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,3]],"date-time":"2025-08-03T04:01:47Z","timestamp":1754193707893},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702329","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T15:09:52Z","timestamp":1389366592000},"page":"1-8","source":"Crossref","is-referenced-by-count":3,"title":["Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack"],"prefix":"10.1109","author":[{"given":"Keiji","family":"Matsumoto","sequence":"first","affiliation":[]},{"given":"Soichiro","family":"Ibaraki","sequence":"additional","affiliation":[]},{"given":"Kuniaki","family":"Sueoka","sequence":"additional","affiliation":[]},{"given":"Katsuyuki","family":"Sakuma","sequence":"additional","affiliation":[]},{"given":"Hidekazu","family":"Kikuchi","sequence":"additional","affiliation":[]},{"given":"Hiroyuki","family":"Mori","sequence":"additional","affiliation":[]},{"given":"Yasumitsu","family":"Orii","sequence":"additional","affiliation":[]},{"given":"Fumiaki","family":"Yamada","sequence":"additional","affiliation":[]},{"given":"Kohei","family":"Fujihara","sequence":"additional","affiliation":[]},{"given":"Junichi","family":"Takamatsu","sequence":"additional","affiliation":[]},{"given":"Koji","family":"Kondo","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2009.4810783"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2012.6188819"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2011.5767189"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.5104\/jiep.14.413"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.2497\/jjspm.57.678"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.2497\/jjspm.57.10"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2010.5444319"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702329.pdf?arnumber=6702329","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,9,27]],"date-time":"2021-09-27T18:00:43Z","timestamp":1632765643000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6702329\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702329","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}