{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,25]],"date-time":"2026-02-25T18:11:12Z","timestamp":1772043072272,"version":"3.50.1"},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702330","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T15:09:52Z","timestamp":1389366592000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D\/3D through-silicon via integrated circuits"],"prefix":"10.1109","author":[{"given":"Yann","family":"Civale","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Herman","family":"Meynen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ranjith S. E.","family":"John","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Peng-Fei","family":"Fu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Craig R.","family":"Yeakle","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheng","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Stefan","family":"Krausse","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thomas","family":"Rapps","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Stefan","family":"Lutter","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1145\/966747.966750"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2008.4763408"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575558"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4550028"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575759"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2011.2125791"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796763"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575557"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575559"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2013,10,2]]},"end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702330.pdf?arnumber=6702330","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T13:47:10Z","timestamp":1490190430000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702330\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702330","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}