{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T00:23:15Z","timestamp":1725668595989},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702345","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T20:09:52Z","timestamp":1389384592000},"page":"1-6","source":"Crossref","is-referenced-by-count":9,"title":["A compact 3D silicon interposer package with integrated antenna for 60GHz wireless applications"],"prefix":"10.1109","author":[{"given":"Y.","family":"Lamy","sequence":"first","affiliation":[]},{"given":"L.","family":"Dussopt","sequence":"additional","affiliation":[]},{"given":"O. El","family":"Bouayadi","sequence":"additional","affiliation":[]},{"given":"C.","family":"Ferrandon","sequence":"additional","affiliation":[]},{"given":"A.","family":"Siligaris","sequence":"additional","affiliation":[]},{"given":"C.","family":"Dehos","sequence":"additional","affiliation":[]},{"given":"P.","family":"Vincent","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248962"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.2529\/PIERS080907133328"},{"key":"11","article-title":"Marked reliability increase of plastic-cored solder ball for large size wafer-level CSP","author":"ishida","year":"0","journal-title":"Int Wafer Level Pack Conference 2012"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575599"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2166662"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2006.877832"},{"journal-title":"Ultrabook Latitude 6430u","year":"0","key":"1"},{"key":"10","article-title":"Innovative wafer-level encapsulation & underfill material for Si interposer application","author":"ferrandon","year":"0","journal-title":"63rd IEEE Electronic Components and Technology Conference (ECTC 2013) May 28-31 2013 Las Vegas NV USA"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2012.6259424"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2011.5940637"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/APS.2012.6348633"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176982"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490835"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575835"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702345.pdf?arnumber=6702345","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T17:55:37Z","timestamp":1490205337000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702345\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702345","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}