{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T11:26:22Z","timestamp":1725794782379},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702355","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T20:09:52Z","timestamp":1389384592000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["A study on wafer level TSV build-up integration method"],"prefix":"10.1109","author":[{"given":"Jae Hak","family":"Lee","sequence":"first","affiliation":[]},{"given":"Hyoung Joon","family":"Kim","sequence":"additional","affiliation":[]},{"given":"Jun-Yeob","family":"Song","sequence":"additional","affiliation":[]},{"given":"Chang Woo","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Tae Ho","family":"Ha","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"crossref","DOI":"10.1007\/978-0-387-76534-1","author":"tan","year":"2008","journal-title":"Wafer Level 3-D ICs Process Technology"},{"key":"2","first-page":"715","article-title":"Aligned fusion wafer bonding for wafer-level packaging and 3D integration","author":"matthias","year":"2005","journal-title":"IMAPS"},{"key":"1","article-title":"Advanced-chip-to-wafer technology: Enabling technology for volume production of 3D system integration on wafer level","author":"scheiring","year":"2004","journal-title":"IMAPS"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2004.1345704"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306559"},{"journal-title":"Advanced IC Packaging Technologies and Markets","year":"2009","author":"winkler","key":"5"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1002\/9783527623051"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702355.pdf?arnumber=6702355","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,22]],"date-time":"2017-06-22T05:51:21Z","timestamp":1498110681000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702355\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702355","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}