{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T18:50:39Z","timestamp":1725389439490},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702371","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T20:09:52Z","timestamp":1389384592000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Front to backside alignment for TSV based 3D integration"],"prefix":"10.1109","author":[{"given":"Frank","family":"Windrich","sequence":"first","affiliation":[{"name":"Fraunhofer IZM \u201cAll Silicon System Integration Dresden\u201d - ASSID Moritzburg, Germany"}]},{"given":"Andreas","family":"Schenke","sequence":"additional","affiliation":[{"name":"Fraunhofer IZM \u201cAll Silicon System Integration Dresden\u201d - ASSID Moritzburg, Germany"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"3","DOI":"10.1002\/9783527623051.ch2"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1002\/9783527623051.ch16"},{"key":"1","article-title":"Heterogeneous system integration a key technology for future microelectronic applications","author":"wolf","year":"0","journal-title":"Proc Smart System Integration March 23 -24 2010 Como Italy"},{"doi-asserted-by":"publisher","key":"7","DOI":"10.1109\/ECTC.2012.6249006"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1109\/EPTC.2009.5416509"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1147\/JRD.2008.5388563"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1109\/ECTC.2010.5490637"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702371.pdf?arnumber=6702371","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,6,8]],"date-time":"2021-06-08T07:31:39Z","timestamp":1623137499000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6702371\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702371","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}