{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T10:57:47Z","timestamp":1725620267660},"reference-count":30,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702377","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T15:09:52Z","timestamp":1389366592000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Vertically integrated processor and memory module design for vector supercomputers"],"prefix":"10.1109","author":[{"given":"Ryusuke","family":"Egawa","sequence":"first","affiliation":[]},{"given":"Masayuki","family":"Sato","sequence":"additional","affiliation":[]},{"given":"Jubee","family":"Tada","sequence":"additional","affiliation":[]},{"given":"Hiroaki","family":"Kobayashi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1109\/IPDPS.2009.5161089"},{"year":"0","key":"17"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898657"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC.2012.6398388"},{"key":"16","first-page":"80","article-title":"An 810-gb\/s source-synchronous i\/o system based on high-density silicon carrier interconnects","author":"dickson","year":"2011","journal-title":"VLSI Circuits (VLSIC) 2011 Symposium on"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1145\/1555754.1555761"},{"key":"14","doi-asserted-by":"crossref","first-page":"554","DOI":"10.1145\/1391469.1391610","article-title":"circuit and microarchitecture evaluation of 3d stacking magnetic ram (mram) as a universal memory replacement","author":"xiangyu dong","year":"2008","journal-title":"2008 45th ACM\/IEEE Design Automation Conference DAC"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2006.18"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2013.6575674"},{"key":"20","article-title":"NEC 's solution portfolio","author":"fischer","year":"0","journal-title":"Exhibitor Forum in International Conference on High Performance Computing Networking Storage and Analysis (SC10) 2010"},{"key":"22","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.884079"},{"key":"23","first-page":"279","article-title":"FDTD Simulation on Array Antenna SARGPR for Land Mine Detection","author":"kobayashi","year":"2003","journal-title":"Proceedings of SSR2003"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1080\/10407780590911558"},{"key":"25","first-page":"69","article-title":"Study of High Gain and Broadband Antipodal Fermi Antenna with Corrugation","author":"takagi","year":"2004","journal-title":"2004 International Symposium on Antennas and Propagation"},{"key":"26","doi-asserted-by":"publisher","DOI":"10.1016\/j.epsl.2007.01.019"},{"key":"27","first-page":"136","article-title":"Direct Numerical Simulations For Instabilities Of Remixed Planar Flames","author":"tsuboi","year":"2003","journal-title":"The Fourth Asia-Pacific Conference on Combustion"},{"key":"28","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2012.6263026"},{"journal-title":"CACTI 6 5","year":"2009","author":"muralimanohar","key":"29"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242474"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.1998.658762"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2008.15"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1145\/1654059.1654088"},{"key":"30","doi-asserted-by":"publisher","DOI":"10.1186\/BF03352641"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007471"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007463"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2008.4479795"},{"key":"8","article-title":"Techniques for producing 3d ics with high-density interconnect","author":"gupta","year":"0","journal-title":"Proceedings of the 21st International VLSI Multilevel Interconnection Conference 2004"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702377.pdf?arnumber=6702377","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,22]],"date-time":"2017-06-22T01:51:17Z","timestamp":1498096277000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702377\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":30,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702377","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}