{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T13:59:35Z","timestamp":1777471175224,"version":"3.51.4"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702380","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T20:09:52Z","timestamp":1389384592000},"page":"1-7","source":"Crossref","is-referenced-by-count":12,"title":["Performance and process characteristic of glass interposer with through-glass-via(TGV)"],"prefix":"10.1109","author":[{"given":"Chun-Hsien","family":"Chien","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hsun","family":"Yu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ching-Kuan","family":"Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yu-Min","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ren-Shin","family":"Cheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chau-Jie","family":"Zhan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Peng-Shu","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chang-Chih","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chao-Kai","family":"Hsu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hsiang-Hung","family":"Chang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Huan-Chun","family":"Fu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuan-Chang","family":"Lee","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wen-Wei","family":"Shen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cheng-Ta","family":"Ko","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei-Chung","family":"Lo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yung Jean","family":"Lu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","author":"young","year":"1989","journal-title":"The Technical Writer's Handbook"},{"key":"2","first-page":"16","article-title":"NXP System-in-Package vision and latest 3D technology developments","volume":"34","author":"yannou","year":"2007","journal-title":"Advancing Microelectronics"},{"key":"1","author":"garrou","year":"2009","journal-title":"Qualcomm's Nowak 3-D Faces Cost Issues"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2012.6469406"},{"key":"6","year":"0"},{"key":"5","year":"0"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490913"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/IMPACT.2013.6706691"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2013,10,2]]},"end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702380.pdf?arnumber=6702380","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T18:20:47Z","timestamp":1490206847000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702380\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702380","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}