{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,8]],"date-time":"2026-02-08T08:14:30Z","timestamp":1770538470246,"version":"3.49.0"},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702382","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T15:09:52Z","timestamp":1389366592000},"page":"1-8","source":"Crossref","is-referenced-by-count":43,"title":["The development and evaluation of RF TSV for 3D IPD applications"],"prefix":"10.1109","author":[{"given":"Thorbjorn","family":"Ebefors","sequence":"first","affiliation":[]},{"given":"Jessica","family":"Fredlund","sequence":"additional","affiliation":[]},{"given":"Daniel","family":"Perttu","sequence":"additional","affiliation":[]},{"given":"Raymond","family":"van Dijk","sequence":"additional","affiliation":[]},{"given":"Lorenzo","family":"Cifola","sequence":"additional","affiliation":[]},{"given":"Mikko","family":"Kaunisto","sequence":"additional","affiliation":[]},{"given":"Pekka","family":"Rantakari","sequence":"additional","affiliation":[]},{"given":"Tauno","family":"Vaha-Heikkila","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/22.817474"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.5772\/8418"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2007.893794"},{"key":"1","article-title":"Tunable Antenna Systems for Mobile Phones Based on Piezo MEMS","author":"metzger","year":"0","journal-title":"3rd Int Piezo-MEMS Workshop in Washington DC April 9th 2013"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.38.2393"},{"key":"6","article-title":"Low-Loss Broadband Package Platform With Surface Passivation and TSV for Wafer-Level Packaging of RF-MEMS Devices","volume":"pp","author":"chen","year":"2013","journal-title":"IEEE Trans on Components Packaging and Manufacturing Technology"},{"key":"5","article-title":"High-Q Integrated 3D Inductors and Transformers for High Frequency Applications","author":"weon","year":"0","journal-title":"Proc Int Symp Microwave Theory and Tech 2004"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/75.720461"},{"key":"9","article-title":"Successful Experiences from Integration and Compatibility program of New Piezoelectric Materials in a MEMS Foundry Production Line","author":"ebefors","year":"0","journal-title":"3rd Int Piezo-MEMS Workshop in Washington DC April 9th 2013"},{"key":"8","article-title":"Development of New Metallization Processes for High Aspect Ratio Through-Silicon-Via (TSV)","author":"moulodi","year":"0","journal-title":"MME Conference Finland Sept 1-4 2013"},{"key":"11","article-title":"Recent Results Using Met-Via\ufffd TSV Interposer Technology as TMV Element in Wafer-Level Through Mold Via Packaging of CMOS Biosensors","author":"ebefors","year":"0","journal-title":"International Wafer-Level Packaging Conference IWLPC November 5-7 2013 San Jose CA"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","location":"San Francisco, CA, USA","start":{"date-parts":[[2013,10,2]]},"end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702382.pdf?arnumber=6702382","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T17:46:49Z","timestamp":1490204809000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702382\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702382","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}