{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:15:30Z","timestamp":1730193330598,"version":"3.28.0"},"reference-count":16,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702386","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T15:09:52Z","timestamp":1389366592000},"page":"1-5","source":"Crossref","is-referenced-by-count":9,"title":["Pulsed laser annealing: A scalable and practical technology for monolithic 3D IC"],"prefix":"10.1109","author":[{"given":"Bipin","family":"Rajendran","sequence":"first","affiliation":[]},{"given":"Albert K.","family":"Henning","sequence":"additional","affiliation":[]},{"given":"Brian","family":"Cronquist","sequence":"additional","affiliation":[]},{"given":"Zvi","family":"Or-Bach","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"article-title":"Process for the Production of Thin Semiconductor Films","year":"1994","author":"bruel","key":"15"},{"key":"16","article-title":"Building Blocks for Wafer-Level 3D Integration","author":"sadaka","year":"2010","journal-title":"Solid State Technology"},{"key":"13","article-title":"Stefan's Problem: Validation of a one-dimensional solid-liquid phase change heat transfer process","author":"ogoh","year":"0","journal-title":"Proceedings COMSOL Conference (2010)"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1364\/JOSA.65.000742"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1023\/A:1017562709942"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.35.L648"},{"key":"3","article-title":"Monolithic 3D-ICs with Single crystal Silicon Layers","author":"deepak","year":"0","journal-title":"IEEE 3DIC Conference 2012"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1147\/rd.504.0491"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490828"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRev.134.A1058"},{"key":"7","article-title":"Low-Temperature Wafer Bonding: A Study of Void Formation and Influence on Bonding Strength","volume":"14","author":"zhang","year":"2005","journal-title":"IEEE Journal of Microelectromechanical Systems"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ISTDM.2012.6222439"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487798"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2007.891300"},{"journal-title":"Silicon Semiconductor Data","year":"1969","author":"wolf","key":"9"},{"journal-title":"Low Thermal Budget Processing for Sequential Three Dimensional Integrated Circuit Fabrication","year":"2006","author":"rajendran","key":"8"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702386.pdf?arnumber=6702386","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T14:20:52Z","timestamp":1490192452000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702386\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702386","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}