{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T15:26:51Z","timestamp":1725463611607},"reference-count":3,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,10]]},"DOI":"10.1109\/3dic.2013.6702401","type":"proceedings-article","created":{"date-parts":[[2014,1,10]],"date-time":"2014-01-10T15:09:52Z","timestamp":1389366592000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Investigation of optimized high-density flip-chip interconnect design including micro Au bumps for 3-D stacked LSI packaging"],"prefix":"10.1109","author":[{"given":"Katsuya","family":"Kikuchi","sequence":"first","affiliation":[]},{"given":"Fumiki","family":"Kato","sequence":"additional","affiliation":[]},{"given":"Shunsuke","family":"Nemoto","sequence":"additional","affiliation":[]},{"given":"Hiroshi","family":"Nakagawa","sequence":"additional","affiliation":[]},{"given":"Masahiro","family":"Aoyagi","sequence":"additional","affiliation":[]},{"given":"Youtaro","family":"Yasu","sequence":"additional","affiliation":[]},{"given":"Kohji","family":"Koshiji","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","first-page":"221","article-title":"Investigation for Signal Characteristic of High Density Interconnection with Micro Au Bumps","author":"yasu","year":"2011","journal-title":"Proceedings of 22th Microelectronics Symposium (MES2011)"},{"key":"2","first-page":"500","article-title":"Electrical Properties of Micro Au Bump Array For-chip Interconnection Made by Electroless Au Plating","author":"kato","year":"2010","journal-title":"Proc Int Conf Electronic Packaging Technology"},{"key":"1","first-page":"850","article-title":"Design and Development of Fine Pitch Copper\/Low-K Wafer Level Package","author":"srinivasa","year":"2008","journal-title":"Proc of 10th Electronic Components and Tech Conf (EPTC 2008)"}],"event":{"name":"2013 IEEE International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2013,10,2]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2013,10,4]]}},"container-title":["2013 IEEE International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6690582\/6702313\/06702401.pdf?arnumber=6702401","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T13:46:51Z","timestamp":1490190411000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6702401\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,10]]},"references-count":3,"URL":"https:\/\/doi.org\/10.1109\/3dic.2013.6702401","relation":{},"subject":[],"published":{"date-parts":[[2013,10]]}}}