{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,18]],"date-time":"2026-09-18T12:09:21Z","timestamp":1789733361774,"version":"4.0.1"},"reference-count":23,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/3dic.2014.7152163","type":"proceedings-article","created":{"date-parts":[[2015,7,17]],"date-time":"2015-07-17T16:15:00Z","timestamp":1437149700000},"page":"1-7","source":"Crossref","is-referenced-by-count":19,"title":["Thermal performance of 3D ICs: Analysis and alternatives"],"prefix":"10.1109","author":[{"given":"Cristiano","family":"Santos","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pascal","family":"Vivet","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jean-Philippe","family":"Colonna","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Perceval","family":"Coudrain","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ricardo","family":"Reis","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","first-page":"22c","article-title":"A 0.9 pJ\/bit, 12.8 GByte\/s wideIO memory interface in a 3D-IC NoC-based MPSoC","author":"dutoit","year":"2013","journal-title":"Symposium of VLSI Circuits"},{"key":"ref11","article-title":"Using TSVs for Thermal Mitigation in 3D Circuits: Wish and Truth","author":"santos","year":"0","journal-title":"International 3D Systems Integration Conference (3DIC) 2014 to be published"},{"key":"ref12","year":"0","journal-title":"DOCEA Power Inc"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2014.6946045"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2012.6262977"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131502"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2005.1560164"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.870069"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2011.5993673"},{"key":"ref19","first-page":"1","article-title":"On the futility of thermal through-silicon-vias","author":"chou","year":"2013","journal-title":"International Symposium on VLSI Design Automation and Test (VLSI-DAT)"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074080"},{"key":"ref3","first-page":"1","article-title":"A simple and approximate analytical model for the estimation of the thermal resistances in 3D stacks of integrated circuits","author":"de cr\u00e9cy","year":"2012","journal-title":"International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)"},{"key":"ref6","doi-asserted-by":"crossref","first-page":"131","DOI":"10.1109\/STHERM.2011.5767190","article-title":"Steady state and transient thermal analysis of hotspots in 3D stacked ICs using dedicated test chips","author":"oprins","year":"2011","journal-title":"Proceedings of the Semiconductor Thermal Measurement Modeling and Management Symposium (SEMI-Therm)"},{"key":"ref5","first-page":"56","article-title":"Thermal analysis of hotspots in advanced 3D-stacked structures","author":"torregiani","year":"2009","journal-title":"20th International Workshop on Thermal Investigations of ICs and Systems"},{"key":"ref8","first-page":"1081","article-title":"Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack","author":"oprins","year":"2012","journal-title":"Electronic Components and Technology Conference (ECTC)"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898612"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2009.2020916"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2074070"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2012.6507102"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2008.4544386"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897347"},{"key":"ref21","first-page":"618","volume":"30","author":"tong","year":"2011","journal-title":"Advanced Materials for Thermal Management of Electronic Packaging"},{"key":"ref23","article-title":"PGS Graphite Sheet","year":"0"}],"event":{"name":"2014 International 3D Systems Integration Conference (3DIC)","location":"Kinsdale, Ireland","start":{"date-parts":[[2014,12,1]]},"end":{"date-parts":[[2014,12,3]]}},"container-title":["2014 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7147632\/7152139\/07152163.pdf?arnumber=7152163","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,8,28]],"date-time":"2019-08-28T06:47:00Z","timestamp":1566974820000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7152163\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/3dic.2014.7152163","relation":{},"subject":[],"published":{"date-parts":[[2014,12]]}}}