{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T21:22:07Z","timestamp":1725484927907},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/3dic.2014.7152169","type":"proceedings-article","created":{"date-parts":[[2015,7,17]],"date-time":"2015-07-17T20:15:00Z","timestamp":1437164100000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Conventional magnetron sputtering of metal seed layers on high aspect ratio vias with tilting"],"prefix":"10.1109","author":[{"given":"Young Sik","family":"Song","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yunho","family":"Han","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tai Hong","family":"Yim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/0040-6090(95)08014-7"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/66.484292"},{"year":"2013","author":"song","key":"ref6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/S0040-6090(98)01728-3"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1116\/1.577531"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.electacta.2013.09.096"}],"event":{"name":"2014 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2014,12,1]]},"location":"Kinsdale, Ireland","end":{"date-parts":[[2014,12,3]]}},"container-title":["2014 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7147632\/7152139\/07152169.pdf?arnumber=7152169","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T22:24:55Z","timestamp":1490394295000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7152169\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/3dic.2014.7152169","relation":{},"subject":[],"published":{"date-parts":[[2014,12]]}}}