{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,6]],"date-time":"2026-05-06T15:36:13Z","timestamp":1778081773445,"version":"3.51.4"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,12]]},"DOI":"10.1109\/3dic.2014.7152170","type":"proceedings-article","created":{"date-parts":[[2015,7,17]],"date-time":"2015-07-17T20:15:00Z","timestamp":1437164100000},"page":"1-5","source":"Crossref","is-referenced-by-count":5,"title":["Fault detection and isolation of multiple defects in through silicon via (TSV) channel"],"prefix":"10.1109","author":[{"given":"Daniel H.","family":"Jung","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Heegon Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jonghoon J.","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Sukjin Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Joungho","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Hyun-Cheol Bae","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Kwang-Seong Choi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"624","article-title":"Failure mechanisms and optimum design for electroplated copper Through-Silicon Vias (TSV)","author":"xi","year":"2009","journal-title":"Electronic Components and Technology Conference 2009 ECTC 2009 59th"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702376"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2013.6532027"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681638"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898702"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/EMCCompo.2013.6735193"},{"key":"ref1","author":"papanikolaou","year":"2011"}],"event":{"name":"2014 International 3D Systems Integration Conference (3DIC)","location":"Kinsdale, Ireland","start":{"date-parts":[[2014,12,1]]},"end":{"date-parts":[[2014,12,3]]}},"container-title":["2014 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7147632\/7152139\/07152170.pdf?arnumber=7152170","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,2,12]],"date-time":"2022-02-12T00:58:23Z","timestamp":1644627503000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7152170\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,12]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2014.7152170","relation":{},"subject":[],"published":{"date-parts":[[2014,12]]}}}