{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T04:33:22Z","timestamp":1725510802591},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334553","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS1.4.1-TS1.4.8","source":"Crossref","is-referenced-by-count":0,"title":["Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement"],"prefix":"10.1109","author":[{"given":"A.","family":"Jouve","sequence":"first","affiliation":[]},{"given":"Y.","family":"Sinquin","sequence":"additional","affiliation":[]},{"given":"A.","family":"Garnier","sequence":"additional","affiliation":[]},{"given":"M.","family":"Daval","sequence":"additional","affiliation":[]},{"given":"P.","family":"Chausse","sequence":"additional","affiliation":[]},{"given":"M.","family":"Argoud","sequence":"additional","affiliation":[]},{"given":"N.","family":"Allouti","sequence":"additional","affiliation":[]},{"given":"L.","family":"Baud","sequence":"additional","affiliation":[]},{"given":"J.","family":"Dechamp","sequence":"additional","affiliation":[]},{"given":"R.","family":"Franiatte","sequence":"additional","affiliation":[]},{"given":"S.","family":"Cheramy","sequence":"additional","affiliation":[]},{"given":"H.","family":"Kato","sequence":"additional","affiliation":[]},{"given":"K.","family":"Kondo","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","article-title":"3DICs: Recent advances in the industry","author":"ramalingam","year":"2014","journal-title":"Semicon Japan"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2014.6946001"},{"key":"ref6","first-page":"679","article-title":"2.5DThrough Interposer Package Fabrication by Chip-on-Wafer (CoW) Approach","author":"ho","year":"2014","journal-title":"Proc 5th Electronics Packaging Technology Conference (EPTC)"},{"key":"ref5","first-page":"761","article-title":"Innovatinve Wafer-Level Encapsulation & Underfill Material for Silicon Interposer Application","author":"ferrandon","year":"2013","journal-title":"Proceedings of the Electronic Components Technology Conference"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702394"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2012.6241775"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.4071\/isom-WP11"},{"key":"ref9","first-page":"187","article-title":"Parametric DesignStudy for Minimized Warpage of WL-CSP","author":"hong","year":"2008","journal-title":"2nd Electonics Systemintegration Technology Conference"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898528"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334553.pdf?arnumber=7334553","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T00:42:01Z","timestamp":1490402521000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334553\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334553","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}