{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T21:17:34Z","timestamp":1725398254267},"reference-count":4,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334556","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS2.3.1-TS2.3.5","source":"Crossref","is-referenced-by-count":5,"title":["New signal skew cancellation method for 2 Gbps transmission in glass and organic interposers to achieve 2.5D package employing next generation high bandwidth memory (HBM)"],"prefix":"10.1109","author":[{"given":"Shuuichi","family":"Kariyazaki","sequence":"first","affiliation":[]},{"given":"Kenichi","family":"Kuboyama","sequence":"additional","affiliation":[]},{"given":"Ryuichi","family":"Oikawa","sequence":"additional","affiliation":[]},{"given":"Takuo","family":"Funaya","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159603"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159607"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICSJ.2014.7009629"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897367"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334556.pdf?arnumber=7334556","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T20:01:32Z","timestamp":1490385692000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334556\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334556","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}