{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T00:47:57Z","timestamp":1725670077978},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334562","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS9.2.1-TS9.2.4","source":"Crossref","is-referenced-by-count":3,"title":["Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers"],"prefix":"10.1109","author":[{"given":"Masahide","family":"Goto","sequence":"first","affiliation":[]},{"given":"Kei","family":"Hagiwara","sequence":"additional","affiliation":[]},{"given":"Yoshinori","family":"Iguchi","sequence":"additional","affiliation":[]},{"given":"Hiroshi","family":"Ohtake","sequence":"additional","affiliation":[]},{"given":"Takuya","family":"Saraya","sequence":"additional","affiliation":[]},{"given":"Masaharu","family":"Kobayashi","sequence":"additional","affiliation":[]},{"given":"Eiji","family":"Higurashi","sequence":"additional","affiliation":[]},{"given":"Hiroshi","family":"Toshiyoshi","sequence":"additional","affiliation":[]},{"given":"Toshiro","family":"Hiramoto","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/16.930657"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131506"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046980"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.882043"},{"year":"2003","key":"ref11"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609348"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7046981"},{"key":"ref8","first-page":"125","article-title":"Hybrid Bonding Characteristics of Au\/SiO2 Substrates for 3D Integrated Image Sensors","author":"hagiwara","year":"2013","journal-title":"Conference on Wafer Bonding for Microsystems and Wafer Level Integration"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2013.6716519"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424351"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2331975"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796763"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334562.pdf?arnumber=7334562","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T00:36:25Z","timestamp":1490402185000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334562\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334562","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}