{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T22:18:24Z","timestamp":1725401904640},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334570","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T22:46:57Z","timestamp":1448318817000},"page":"TS5.4.1-TS5.4.4","source":"Crossref","is-referenced-by-count":0,"title":["High-speed via hole filling using electrophoresis of Ag nanoparticles"],"prefix":"10.1109","author":[{"given":"Ryo","family":"Takigawa","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kohei","family":"Nitta","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Akihiro","family":"Ikeda","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mitsuaki","family":"Kumazawa","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Toshiharu","family":"Hirai","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Michio","family":"Komatsu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tanemasa","family":"Asano","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1149\/1.3313451"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1149\/1.1572154"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.53.06JH01"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.51.06FG11"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.40.3032"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/40.710867"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334570.pdf?arnumber=7334570","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T23:52:49Z","timestamp":1490399569000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334570\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334570","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}