{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,22]],"date-time":"2026-01-22T09:13:30Z","timestamp":1769073210538,"version":"3.49.0"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2015,8,1]],"date-time":"2015-08-01T00:00:00Z","timestamp":1438387200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2015,8,1]],"date-time":"2015-08-01T00:00:00Z","timestamp":1438387200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334572","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS6.2.1-TS6.2.5","source":"Crossref","is-referenced-by-count":2,"title":["Comprehensive comparison of 3D-TSV integrated solid-state drives (SSDs) with storage class memory and NAND flash memory"],"prefix":"10.1109","author":[{"given":"Shogo","family":"Hachiya","sequence":"first","affiliation":[{"name":"Chuo University, Tokyo, Japan"}]},{"given":"Takahiro","family":"Onagi","sequence":"additional","affiliation":[{"name":"Chuo University, Tokyo, Japan"}]},{"given":"Sheyang","family":"Ning","sequence":"additional","affiliation":[{"name":"Chuo University, Tokyo, Japan"}]},{"given":"Ken","family":"Takeuchi","sequence":"additional","affiliation":[{"name":"Chuo University, Tokyo, Japan"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.7567\/SSDM.2013.H-3-3"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICEP-IAAC.2015.7111027"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2012.6243825"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101930"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757454"},{"key":"ref2","first-page":"9","article-title":"Requirements for Performance of Non-Volatile Memories in 3D TSV-Integrated Hybrid ReRAM\/MLC NAND Solid-State Drive","volume":"114","author":"miyaji","year":"2014","journal-title":"IEICE technical report Technical Committee on Integrated Circuits and Devices (ICD)"},{"key":"ref1","first-page":"134","article-title":"x11 performance increase, x6.9 endurance enhancement, 93% energy reduction of 3D TSV-integrated hy-brid ReRAM\/MLC NAND SSDs by data fragmentation suppression","author":"fujii","year":"2012","journal-title":"IEEE Symposium on VLSI Circuits"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","location":"Sendai, Japan","start":{"date-parts":[[2015,8,31]]},"end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334572.pdf?arnumber=7334572","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,15]],"date-time":"2025-08-15T18:15:27Z","timestamp":1755281727000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7334572\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334572","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}