{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,27]],"date-time":"2025-08-27T15:35:21Z","timestamp":1756308921391},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334574","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS6.4.1-TS6.4.8","source":"Crossref","is-referenced-by-count":7,"title":["3D ICs: An opportunity for fully-integrated, dense and efficient power supplies"],"prefix":"10.1109","author":[{"given":"Gael","family":"Pillonnet","sequence":"first","affiliation":[]},{"given":"Nicolas","family":"Jeanniot","sequence":"additional","affiliation":[]},{"given":"Pascal","family":"Vivet","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2072997"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2416315"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2011.2171996"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2399025"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-SoC.2013.6673297"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2013.6690979"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2015.2462016"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2015.2462014"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.917321"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2076550"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2013.6520285"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2013.2240465"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2369503"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751437"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2012.2235084"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"432","DOI":"10.1109\/APEC.2014.6803344","article-title":"FIVR - Fully integrated voltage regulators on 4th generation Intel Core SoCs","author":"burton","year":"2014","journal-title":"2014 Twenty-Ninth Annual IEEE Applied Power Electronics Conference and Exposition (APEC)"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897459"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334574.pdf?arnumber=7334574","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,23]],"date-time":"2017-06-23T20:14:24Z","timestamp":1498248864000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334574\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334574","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}