{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T09:15:55Z","timestamp":1730193355852,"version":"3.28.0"},"reference-count":35,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334578","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T17:46:57Z","timestamp":1448300817000},"page":"TS7.4.1-TS7.4.4","source":"Crossref","is-referenced-by-count":1,"title":["Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding"],"prefix":"10.1109","author":[{"given":"Takafumi","family":"Fukushima","sequence":"first","affiliation":[]},{"given":"Taku","family":"Suzuki","sequence":"additional","affiliation":[]},{"given":"Hideto","family":"Hashiguchi","sequence":"additional","affiliation":[]},{"given":"Chisato","family":"Nagai","sequence":"additional","affiliation":[]},{"given":"Jichoel","family":"Bea","sequence":"additional","affiliation":[]},{"given":"Hiroyuki","family":"Hashimoto","sequence":"additional","affiliation":[]},{"given":"Mariappan","family":"Murugesan","sequence":"additional","affiliation":[]},{"given":"Kang-Wook","family":"Lee","sequence":"additional","affiliation":[]},{"given":"Tetsu","family":"Tanaka","sequence":"additional","affiliation":[]},{"given":"Kazushi","family":"Asami","sequence":"additional","affiliation":[]},{"given":"Yasuhiro","family":"Kitamura","sequence":"additional","affiliation":[]},{"given":"Mitsumasa","family":"Koyanagi","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.54.030206"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897434"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702360"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.52.04CB09"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159615"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159614"},{"key":"ref10","first-page":"186","article-title":"Three-dimensional processor system fabricated by wafer stacking technology","author":"ono","year":"2002","journal-title":"Proc Int Symp Low-Power and High-Speed Chips (COOL Chips V)"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/40.710867"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.884079"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007463"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.43.L829"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.45.3030"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2005.1609347"},{"key":"ref17","first-page":"836","article-title":"Self-assembly pocess for chip-to-wafer three-dimensional integration","author":"fukushima","year":"2007","journal-title":"Proc of 57th Electronic Components and Technology Conf (ECTC)"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2007.4419119"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2008.4550179"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2012.6479157"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.37.1217"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248860"},{"key":"ref3","first-page":"460","article-title":"New three-dimensional wafer bonding technology using adhesive injection method","author":"matsumoto","year":"1997","journal-title":"Proc 29th Int Conf Solid State Devices and Mater (SSDM)"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1999.824289"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2012.2212709"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.38.2406"},{"key":"ref8","first-page":"165","article-title":"Three-dimensional-shared memory fabricated using wafer stacking technology","author":"lee","year":"2000","journal-title":"Tech Dig Int Electron Devices Meeting (IEDM)"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.39.2473"},{"key":"ref2","first-page":"1073","article-title":"Three-dimensional integration technology based on wafer bonding technique using micro-bumps","author":"matsumoto","year":"1995","journal-title":"Proc Int Conf Solid State Devices and Mater (SSDM)"},{"key":"ref9","first-page":"270","article-title":"Neuromorphic vision chip fabricated using three-dimensional integration technology","author":"koyanagi","year":"2001","journal-title":"Proc IEEE Int Solid State Circuits Conf (ISSCC)"},{"key":"ref1","first-page":"55","article-title":"Roadblocks in Achieving Three-Dimensional LSI","author":"koyanagi","year":"1989","journal-title":"Proc 8th Symposium on Future Electron Devices"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2008.4796735"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1063\/1.3328098"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424353"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.3390\/mi2010049"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490830"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898799"},{"key":"ref25","first-page":"1873","article-title":"A multi-chip self-assembly technology for advanced die-to-wafer 3D integration to precisely align known good dies in batch processing","volume":"1","author":"fukushima","year":"2011","journal-title":"IEEE Trans Electron Packag Manuf"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334578.pdf?arnumber=7334578","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,25]],"date-time":"2017-03-25T00:41:58Z","timestamp":1490402518000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334578\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":35,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334578","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}