{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T08:10:56Z","timestamp":1729671056751,"version":"3.28.0"},"reference-count":20,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,8]]},"DOI":"10.1109\/3dic.2015.7334579","type":"proceedings-article","created":{"date-parts":[[2015,11,23]],"date-time":"2015-11-23T22:46:57Z","timestamp":1448318817000},"page":"TS8.10.1-TS8.10.5","source":"Crossref","is-referenced-by-count":0,"title":["Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study"],"prefix":"10.1109","author":[{"given":"M.","family":"Murugesan","sequence":"first","affiliation":[]},{"given":"J.C.","family":"Bea","sequence":"additional","affiliation":[]},{"given":"H.","family":"Hashimoto","sequence":"additional","affiliation":[]},{"given":"K.W.","family":"Lee","sequence":"additional","affiliation":[]},{"given":"M.","family":"Koyanagi","sequence":"additional","affiliation":[]},{"given":"T.","family":"Fukushima","sequence":"additional","affiliation":[]},{"given":"T.","family":"Tanaka","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"73","article-title":"Improved C-V, I-V characteristics for Co-Polymerized Organic Liner in the Through-Silicon-Via for High Frequency Applications by Post hear Treatment","author":"murugesan","year":"2014","journal-title":"Proc Electronic Components Technology Conf (ECTC)"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2009.5424348"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.3399252"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074079"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2005.848574"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/0038-1098(81)90337-9"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1155\/2011\/632139"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.52.1822"},{"key":"ref18","first-page":"9-3.1","article-title":"Characterization Of Local Strain Around Trough Silicon Via Interconnects In Wafer-On-Wafer Structures","author":"nakatsuka","year":"2011","journal-title":"Tech Dig of IEEE 3D-System Integration Conference"},{"key":"ref19","doi-asserted-by":"crossref","first-page":"540","DOI":"10.1109\/TED.2013.2295463","article-title":"Deteriorated Device Characteristics in 3D-LSI Caused by Distorted Silicon Lattice","volume":"61","author":"murugesan","year":"2014","journal-title":"IEEE Trans Electron Devices"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131503"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2010.5703279"},{"key":"ref6","first-page":"85","author":"hoofman","year":"2005","journal-title":"Proc Int Interconnect Technol Conf"},{"key":"ref5","first-page":"9-1.1","article-title":"High Density Cu-TSVs and Reliability Issues","author":"murugesan","year":"2011","journal-title":"Tech Dig of IEEE 3D-Svstem Integration Conference"},{"key":"ref8","first-page":"636","article-title":"Replalcing the PECVD-SiO2 in the Through-Silicon Via of High-Density 3D-LSIs with Highly Scalable Low Cost Organic Liner: Merits and Demerits","author":"murugesan","year":"2014","journal-title":"Proc Electronic Components Technology Conf (ECTC)"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.51.04DB03"},{"key":"ref2","first-page":"26","article-title":"Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k\/metal gate CMOS perfomance","author":"mercha","year":"2010","journal-title":"Tech Dig IEEE International Electron Devices Meeting"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2014.7047054"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2013.6724578"}],"event":{"name":"2015 International 3D Systems Integration Conference (3DIC)","start":{"date-parts":[[2015,8,31]]},"location":"Sendai, Japan","end":{"date-parts":[[2015,9,2]]}},"container-title":["2015 International 3D Systems Integration Conference (3DIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7328029\/7334459\/07334579.pdf?arnumber=7334579","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,24]],"date-time":"2017-06-24T00:14:28Z","timestamp":1498263268000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7334579\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,8]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/3dic.2015.7334579","relation":{},"subject":[],"published":{"date-parts":[[2015,8]]}}}